Broadcom Assembles $60 Billion Financing Package to Fund AI Chip Purchases for Anthropic and Others

Broadcom's Wall Street syndicate is assembling up to $60 billion in financing to help Anthropic and other AI customers purchase chips and infrastructure, placing the semiconductor company on both sides of the transaction as lender and chip supplier. The package is structured as $42 billion in Class A senior-secured debt and $18 billion in Class B junior debt, with Blackstone leading the junior tranche and expected to commit $9 billion itself before syndicating the remainder to other investors.

The deal signals an aggressive push by Broadcom to mirror Nvidia's dominance in AI chip sales by making it easier for cash-hungry AI developers to finance large-scale compute buildouts. Bloomberg also reported that Amazon is separately exploring ways to move Nvidia chips off its balance sheet through similar off-balance sheet special purpose vehicles, with analysts noting that AI circularity in financing structures is increasing across the sector.

Broadcom shares gained more than 2.7% on Friday and outperformed peers by the close of trading, with Taiwan Semiconductor shares also rising in sympathy. Broadcom bonds, however, hit all-time lows on the news, reflecting the scale of the debt being taken on. UBS reiterated its Buy rating on the stock, pointing to a strong AI revenue outlook, and a Seeking Alpha analysis noted that management had already raised FY2026 AI revenue guidance to $58 billion following a third quarter that saw consolidated revenue surge 85.5% year over year and free cash flow rise 110.8% year over year.