Wall Street Banks Assemble Record $60 Billion Chip Financing Package for Broadcom and Anthropic

A Wall Street syndicate is assembling a record $60 billion financing package tied to Broadcom to fund AI chip purchases primarily benefiting Anthropic and other companies, according to people with knowledge of the matter. The deal, reported by the Financial Times and corroborated by Bloomberg, is the largest of its kind and tests lender appetite for AI-linked debt at a scale not seen before.

The structure includes a $42 billion Class A senior-secured tranche for which banks including Bank of America, Citigroup, and Morgan Stanley are poised to send out syndication letters. Broadcom will provide residual value support that effectively backstops that portion of the financing, giving lenders a degree of protection on the senior debt.

Blackstone is also involved in the broader $60 billion package alongside the banks. The deal follows a separate August announcement in which Nvidia partnered with Blackstone and five other major financial institutions to mobilize more than $500 billion for AI infrastructure, underscoring how chipmakers are increasingly turning to structured finance to accelerate demand from AI customers. The Broadcom-Anthropic arrangement highlights the growing scale of financial commitments being made across the AI sector and the concentration of risk that comes with them.