Market Flux Event
Applied Materials and Intel Expand R&D Partnership to Build Next-Generation AI Chips
Read this in the Market Flux appApplied Materials and Intel are broadening their research and development partnership to co-develop next-generation semiconductor technologies for AI-driven computing. The collaboration will focus on advancing transistors, interconnects and advanced packaging, with the goal of accelerating the move from laboratory innovation into high-volume manufacturing.
The joint work will be conducted across two sites: Applied Materials' new EPIC Center, a $5 billion R&D facility, and Intel's Oregon research campus. A key element of the effort is development work around Intel's Foveros 3D chip-stacking technology, which stacks chiplets vertically to improve performance and power efficiency in advanced packaging designs.
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- TheTradeXchange$AMAT - Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing
- FirstSquawkAPPLIED MATERIALS, INTEL TO CO-DEVELOP AI CHIP TECH
- FinancialjuiceApplied Materials and Intel to co-develop AI chip tech
- OpenOutcrier$AMAT $INTC Applied Materials and Intel team up on AI chip R&D at EPIC Center
- WallstengineAPPLIED MATERIALS, INTEL TO CO-DEVELOP NEXT-GEN AI CHIP TECHNOLOGY $AMAT and $INTC are expanding their R&D partnership to develop next-generation transistors, interconnects and advanced packaging for AI chips. The work will span Applied’s new EPIC Center and Intel’s Oregon R&D campus, including development around Intel’s Foveros 3D stacking technology, with the goal of moving new AI-focused semiconductor technologies into high-volume manufacturing faster.
- InvestingApplied Materials and Intel team up on AI chip R&D at EPIC Center
- Seeking AlphaApplied Materials, Intel deepen collaboration for AI chipmaking