Market Flux Event

TSMC Draws Up Plans to Manufacture 3D DRAM Chips at NVIDIA's Request

Read this in the Market Flux app

TSMC has begun drawing up plans to manufacture advanced 3D DRAM memory chips, moving into territory long dominated by Samsung, SK Hynix and Micron, according to a report from The Information. The push is being driven by AI-related memory shortages, with NVIDIA specifically requesting that TSMC explore producing the chips to secure additional supply. TSMC shares jumped roughly 6.9% in premarket trading on the news.

Unlike conventional DRAM, 3D DRAM stacks memory cells vertically to achieve greater density, making it well suited for the high-bandwidth demands of AI workloads. TSMC is weighing whether to build new fabrication facilities or convert an existing plant, though no production timeline has been set. The company stated that its core focus remains its logic foundry business.

The potential entry into advanced memory manufacturing would put TSMC in direct competition with the three established DRAM suppliers, Samsung, SK Hynix and Micron, whose shares came under pressure on the report. Analysts flagged the move as a significant shift that could reshape memory supply chains and market dynamics if TSMC proceeds to production.

© AI-generated summary is provided by Market Flux

Sources

  1. LiveSquawkTSMC Weighs Making Advanced Memory Chips To Capture More AI Spending – Information
  2. OpenOutcrier$TSM (+6.9% pre) TSMC Weighs Making Advanced Memory Chips to Capture More AI Spending - The Information Neg $SNDK $MU $SKHY
  3. FinancialjuiceTSMC making plans for 3D DRAM at request of NVIDIA - Information.
  4. ZerohedgeBOOM *TSMC MULLS EXPANDING INTO ADVANCED MEMORY CHIPS: INFORMATION
  5. Crypto BriefingTSMC weighs a move into advanced memory chips, The Information reports
  6. WallstengineTSMC WEIGHS MAKING 3D DRAM AT NVIDIA'S REQUEST $TSM has reportedly begun drawing up plans to manufacture advanced 3D DRAM chips as AI-driven memory shortages push chip designers to seek additional supply, per The Information. Unlike conventional DRAM, 3D DRAM stacks memory cells vertically to increase density. The move could put TSMC in direct competition with Samsung, SK Hynix and Micron. No production timeline has been set. TSMC is considering building new fabs or converting an existing facility, but says its focus remains on its core logic foundry business.